TL-532-18-60-GLASS is a high-precision small-field telecentric scanning lens specifically designed for 532nm green lasers. Manufactured with high-quality optical glass and precision coating technology, it delivers excellent transmittance and a high damage threshold in the green wavelength band, capable of withstanding long-term stable operation in high-power green laser systems.

Featuring an 18mm×18mm scan field and a 60mm focal length, the lens supports normal laser incidence to achieve true telecentric performance—ensuring that the chief ray remains perpendicular to the workpiece across the entire scan field, effectively eliminating edge inclination and pattern distortion commonly associated with conventional galvanometer scanning, while achieving ultimate precision for fine patterns within a small field. The "GLASS" designation indicates the use of high-quality optical glass material, balancing excellent optical performance with cost advantages.

The 532nm green laser offers a short wavelength, small focused spot size, and high energy density, making it particularly suitable for precision processing of highly reflective materials such as copper, aluminum, gold, and silver. Combined with the telecentric optical design of the TL-532-18-60-GLASS, uniform spot size and energy distribution are maintained throughout the scan field, significantly enhancing edge verticality, pattern clarity, and repeatability. The 60mm short focal length enables an extremely small focused spot size and high energy density on the workpiece, making it particularly suitable for micron-level and even sub-micron-level ultra-fine processing applications.

The lens features an optimized multi-element telecentric optical structure that effectively suppresses distortion across the scan field, ensuring accurate reproduction of fine patterns. Precision optical assembly and coating processes provide excellent thermal stability and long-term operational reliability.

The TL-532-18-60-GLASS is widely used in precision engraving of highly reflective materials, LED chip cutting, semiconductor wafer dicing, precision medical device manufacturing, fine scribing of photovoltaic cells, flexible PCB micromachining, and micro-component marking for 3C electronic products, making it an ideal choice for green laser ultra-precision machining applications.